- DAC Sampling Rate: 0.102MSPS
Texas Instruments
Electrical Datasheet
Die Physical Data:
Footprint: 1.827mm² (2832mil²)
Request Pad Layout
- Bits: 8
- Channels: 1
- Interface: Ser SPI
- Architecture: String
- Output Type: Buffered Voltage
- Reference Type: Ext
INL(Max): 0.50±LSB
Settling Time: 3µs
Output Range(Min): n/a
Output Range(Max): n/a
Update Rate: 0.102MSPS
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.