- Features: SDO
- Reference Mode: Ext, Int
- Digital Supply: 2.7V
- Digital Supply: 5.25V
- DAC Sampling Rate : 0.333MSPS
- DAC Channels: 3
- Output Type: Buffered Voltage
Texas Instruments
Electrical Datasheet
Die Physical Data:
Footprint: 15.299mm² (23714mil²)
Request Pad Layout
- Bits: 12
- Channels: 8
- Interface: SPI
- Architecture: SAR
- Input Type: Single-Ended
- Sim Sampling: No
AVDD (Min): 4.75V
AVDD (Max): 5.25V
SNR: n/a
INL(Max): 8.00±LSB
SR(Max): 100.000KSPS
SINAD: n/a
ADC VIN (Min): 0V
ADC VIN (Max): 5.000V
- Interface: SPI
- ADC Channels: 8
- Input Type: Single-Ended
- GPIO: 0
- DAC Channels: 3
- Temp Sensing: Remote
- ADC Bits: 12Bits
- DAC Bits: 12Bits
ADC VIN (Min): 0V
ADC VIN (Max): 5V
ADC SR(Max): 100KSPS
- Bits: 12
- Channels: 8
- Interface: SPI
- Architecture: SAR
- Output Type: Buffered Voltage
- Reference Type: Int, Ext
INL(Max): 8.00±LSB
Settling Time: 3µs
Output Range(Min): n/a
Output Range(Max): n/a
Update Rate: 0.333MSPS
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.