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Bare Die Product Detail: TLV5535 REV 2

High Speed ADC (>10MSPS):
8 Bit, 35 MSPS ADC Single Ch., Low Power
Features:
  • Architecture:  Pipeline
  • Input Buffer:  No
  • Reference Mode:  Ext
  • DNLĀ±(Max):  2.4LSB
  • Digital Supply(Min):  3V
  • Digital Supply(Max):  3.6V
Vendor:
Texas Instruments
  Electrical Datasheet

Die Physical Data:
Footprint: 5.639mm² (8740mil²)
  Request Pad Layout
Product Families: Used for this device are tabulated below.
Functional:
  • Bits: 8
  • Channels: 1
  • Interface: Par CMOS
Specification:
PC(Max): 106mW
AVDD (Min): 3.00V
AVDD (Max): 3.60V
SNR: 46.5dB
INL(Max): 2.4±LSB
SR(Max): 35MSPS
SFDR: 58.0dB
SINAD: 46.0dB
VIN: 1.60Vp-p
ENOB: 7.40Bits
Input BW: 600MHz
Other Detail: Important information for this device is tabulated below.
Traffic light setting for Minimum Order Quantity indicates the following:
  • Green:Available from stock or at low factory MOQ.
  • Amber: Available on factory order with MOQ.
  • Red: High factory MOQ may apply, please ask for details.
Traffic light setting for High Reliability indicates the following:
  • Green: This bare die is specified and tested for use in high reliability applications.
  • Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
  • Red: This bare die is not specified or specifically designed for use in high reliability applications.
Traffic light setting for Space Grade indicates the following:
  • Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
  • Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
  • Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.

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