- Architecture: Pipeline
- Input Buffer: No
- Reference Mode: Ext, Int
- DNLĀ±(Max): 0.9LSB
- Digital Supply(Min): 3V
- Digital Supply(Max): 3.6V
Texas Instruments
Electrical Datasheet
Die Physical Data:
Footprint: 7.355mm² (11400mil²)
Request Pad Layout
- Bits: 12
- Channels: 2
- Interface: Par CMOS
AVDD (Min): 3.00V
AVDD (Max): 3.60V
SNR: 70.7dB
INL(Max): 2.5±LSB
SR(Max): 65MSPS
SFDR: 86.0dB
SINAD: 70.3dB
VIN: 2.00Vp-p
ENOB: 11.30Bits
Input BW: 300MHz
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.