- Features: Pin Programming
Texas Instruments
Electrical Datasheet
Die Physical Data:
Footprint: 4.233mm² (6561mil²)
Request Pad Layout
- I/P Level: LVCMOS
- O/P Level: LVCMOS
- Outputs: 6
- VCC: 3.3V
- VCC (OUT): 3.3V
- Programmability: Pin configuration
- I/P Level: LVCMOS
- O/P Level: LVCMOS
- Function: -
- Outputs: 6
- VCC: 3.3V
- Programmability: Pin configuration
- Divider Ratio: -
VS (Max): 3.60V
fMAX (IN): n/a
fMAX (OUT): 74MHz
Additive RMS Jitter: n/a
RMS Jitter: n/a
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.